| 项目 | 内容（中文） | 内容（英文） |
| 晶圆尺寸 | 2-12 inch | Wafer Size: 2-12 inch |
| 适配材料 | SOI, POI, 混合键合 | Compatible Materials: SOI, POI, Hybrid Bonding |
| 产能 | ≥14 碟/小时 | Production Capacity: ≥14 wafers/hour |
| 上料模式 | Cassette | Loading Method: Cassette |
| 对准精度 | ≤ ±50µm/±0.2µm/100mm（选配） | Alignment Accuracy: ≤ ±50µm/±0.2µm/100mm (Optional) |
| 键合强度 | ≥2.0J/m² (Si-Si 键合退火后) | Bonding Strength: ≥2.0J/m² (Si-Si bonding after annealing) |
| 多模模块一体化集成 | 寻边、等离子体活化、清洗、对准、键合、检测 | Multi-mode Integration: Edge detection, plasma activation, cleaning, alignment, bonding, inspection |
| 药液清洗 | 混配 | Liquid Cleaning: Mixing |
| 其他 | FFU控制机台内清洁度 | Others: FFU-controlled cleanliness in the machine chamber |
